BoLu_CV

卢博/Bo Lu

Data and place of birth: 04.02.1998, Hubei Province of China
Address: Xianning City, Hubei Province, China
Contact: +8615602454711 / alpha_lb@outlook.com

Education & Experience

2020/08 - 2021/04
HUAWEI TECHNOLOGIES CO., LTD, Wuhan China - Process Integration Engineer

2018/09 - 2020/07
Southern University of Science and Technology - Harbin Institute of Technology (joint program), Department of Electrical and Electronic Engineering, Shenzhen China - Master of Engineering
Major: Optical Engineering
Thesis: FABRICATION AND THERMAL STABILITY OF GAN-BASED MICRO-LED DISPLAY ARRAY

2014/09 - 2018/07
China University of Mining and Technology, School of Physics, Xuzhou China - Bachelor of Science
Major: Opto-Electronics Information Science and Engineering
Thesis: Design of GaN-Based Micro-LED Display System

Publications

Journal Paper

• Color Difference and Thermal Stability of Flexible Transparent InGaN/GaN Multiple Quantum Wells Mini-LED Arrays
  B. Lu, Y. Wang, B. Hyun, H. Kuo and Z. Liu
  IEEE Electron Device Letters, 41(7), 1040-1043, 2020. 10.1109/LED.2020.2994143

Conference Proceedings

• Temperature‐dependent Forward Voltage of AlGaInP‐based Red Micro‐LEDs
  Wang, Y., Lu, B., Liu, C., Kuo, H., Hyun, B. and Liu, Z
  SID Symposium Digest of Technical Papers, 51,129-131, 2020. 10.1002/sdtp.13770
• P‐7.4: Thermal Stability Analysis of Micro‐LED arrays
  Lu, B., Jiang, F., Xiong, Z., Wang, Y., Wei, F. and Liu, Z
  SID Symposium Digest of Technical Papers, 50, 807-809, 2019.10.1002/sdtp.13655
• Investigation of Tempreture-denpendent Behaviors of Micro-LED Displays
  Liu, Zhaojun, Lu, Bo, Liu, Minggang et al.
  Proceedings of the International Display Workshops. 1473, 2019. 10.36463/idw.2019.1473

Projects (2018-2021)

• Process Integration
  1. Develop, design and check the inline (Fabcell) and end of line (ePCM/oPCM) monitor structures of silicon photonics devices by python script. in full process.
  2. Maintain and update design pdk and rules as COT member, help product tape out.
  3. Run lots of products at the back end of line (BEOL).
  4. Transfer mask design of full device from manual to script.
  5. Automatically capture Mask data to standardize it, then build a standard format library with FAB.
• Design of 32 × 32 GaN Mini-LED Display System
  The driving circuit (PCB) and display circuit (FPC) designed by Altium Designer were combined with custom made FPGA to demonstrate a Blue Mini-LED display system. Flip-chip technology was used to fabricate 1024 LED chips by transfer bonding each pixel on solder paste precisely.
• Studies of Thermal Stability of Flexible Transparent Mini-LED Array
  The studies of the color change and thermal distribution of a flexible and transparent 32×32 mini-LED array on PET substrate up to a brightness rating of 5000 nits at room temperature was presented. The calculated color differences from the EL spectra at three different brightness are far less than the color discrimination threshold of the human eye corresponding to 0.005 at all testing brightness and meet the display industry requirement for color difference.
• Fabrication of GaN/InGaN Micro-LED
  The InGaN/GaN epitaxy wafer was covered by photoresist and SiO2 partially, and ICP system was used to etch mesa for n-contact. After removing the SiO2, the Ni/Au was used to spread the current. After the current spread layer, electrodes were made for current injection.

Patents

• Lu Bo, Micro light-emitting diode chip and display panel, China Patent, CN:201921765435: U, 20200505
• Lu Bo, Transfer substrate and system of LED Chips, China Patent, CN201921773581.7, 20200724

Other skills

• Basic programming skills for analysis in Python, Matlab